For any inquiries, please contact Dr. H. Parker, Managing Director of Global Engineering Programs and Partnerships.
Faculty Name: Peter Bermel
E-Mail: pbermel@purdue.edu
Project Term: Spring 2026
Project Description:
Transmitting and processing information traditionally involves electronic circuits, which use electrons to do the job. The research in this project uses photons instead, which are individual units of light. These photons have some properties that make them ideal for handling information. They can move fast and carry a lot of data. However, there are still some challenges to overcome when using light for these circuits, like directing it where we want it to go, preventing it from interfering with other light, and switching it on and off when needed.
One of the materials used for making electronic circuits is silicon, which is inexpensive and can be mass-produced in large quantities. When it comes to PICs, however, there is a need to use different materials on top of silicon, which is not easy. In this project, we will seek to create new materials that will serve as the building blocks for the PICs of the future. These materials have special properties, including mutual compatibility, and improved control over light-matter interactions. Furthermore, these materials can be directly deposited and integrated on chips, unlike the current hybrid materials prepared by lithography and patterning methods, which can require additional processing steps.
We'll need help in simulating new photonic materials at the smaller scale (materials level), as well as the circuit level to help guide planned experiments.
Requirements:
Majors: We're particularly interested in ECE, MSE, and ME majors; all College of Engineering majors can apply